Applied Materials continues to extend its technical leadership in metallization, introducing the most significant material innovation in contact and interconnect since copper was introduced for dual damascene 20 years ago. Three new deposition processes are complemented by a new anneal product and a production-proven CMP tool to comprise an end-to-end process suite (illustrated below) that makes it possible to use cobalt as a conducting material and thereby sustain high-performance logic transistor and interconnect scaling.
Applied Materials, with more than 60 years of experience and >700 delivered systems, is the leading supplier of advanced roll-to-roll vacuum coating-systems. Our production platforms are used for deposition of thin films for flexible electronics, packagin
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